Semiconductor Process Development Engineer

Li Auto is hiring a Semiconductor Process Development Engineer for its Munich, DE site. This full-time, onsite role sits at the intersection of production and advanced packaging, geared toward automotive power electronics and semiconductor applications. The team is looking for someone who enjoys hands-on lab work, collaboration with suppliers, and turning ideas into practical manufacturing steps.

In this position, you’ll help develop SiC die attach processes such as sintering, soldering, and embedding, and you’ll work on process development for the connection between power modules and heatsinks. Expect to conduct literature reviews, design experiments, and have technical discussions with suppliers and partners as you evaluate new materials and processes. You’ll also operate a range of packaging equipment and contribute to cleanroom activities, all while documenting your findings in structured technical reports.

If you’re comfortable coordinating with external partners, organizing technical meetings, and preparing progress updates, you’ll likely feel at home here. The role suits someone who wants to shape the future of the industry through hands-on experimentation, careful resource use, and a clear sense of ownership in R&D projects.

Day-to-day moments in the lab and the fab

On a typical day you’ll mix literature insight with experimental design to advance die attach processes for SiC devices, then turn those ideas into concrete tests and materials evaluations. You’ll also shape how power modules connect to heatsinks, weighing different materials and methods, and you’ll run DoE studies while staying in touch with suppliers and partners to gather data and feedback.

Equipment you’ll handle includes die bonding and pick-and-place systems, various printing tools for pastes and solders, and sintering apparatus, plus CNC and laser processing tools for related manufacturing steps. You’ll perform failure analysis and quality checks using CSAM and optical microscopy, among other characterization methods, and you’ll translate what you learn into organized technical reports and progress notes.

Part of the role is helping set up the cleanroom environment, including equipment installation and commissioning, so you’ll be involved in qualification activities as well. You’ll explore new materials, processes, and technologies and contribute to the roadmap for next-generation power modules and other semiconductor applications. Collaboration is a constant theme, as you’ll coordinate with external partners and suppliers and keep meetings and progress records up to date.

Must-haves and nice-to-haves

• An advanced degree in Materials Science, Chemical Engineering, Semiconductor Engineering, MEMS/Microelectronics, Power Electronics, or a closely related field
• Three to five years of relevant industry or research experience in semiconductor processing or advanced packaging
• A self-motivated, results-driven mindset with a proactive ownership approach and a track record of delivering meaningful outcomes
• Hands-on experience with manufacturing or prototyping equipment in the semiconductor sector or packaging environment
• Mechanical design experience, including engineering drawings and tolerance analysis; fixture or jig design; module or package design is a plus
• Fluent English as the working language

• Cleanroom work experience is a plus
• Experience using AI agents or tools to boost working efficiency is a plus

Compensation, benefits and practical details

The role is full-time and onsite at the Munich site. The working language is English.

Advice for applicants

Put the degree that matches the job’s fields, Materials Science, Chemical Engineering, Semiconductor Engineering, MEMS/Microelectronics, or Power Electronics, front and center, and lead with your three to five years of relevant semiconductor processing or advanced packaging work.

Show how you prove the must-haves by naming concrete projects where you designed and executed DoEs, performed materials evaluations, or directly supported die bonding, printing, or sintering operations. Mention any cleanroom work you’ve done and the specific equipment you used, along with the outcomes you helped achieve.

Be ready to talk through hands-on tasks you’ve completed related to mechanical design and packaging, designing fixtures, creating engineering drawings, and performing tolerance analyses, and relate those experiences to potential contributions on the team’s next-gen roadmaps.

Ask a thoughtful question about the near-term process roadmap for next-generation power modules and how the team collaborates with external partners and suppliers to push those initiatives forward. It’s a chance to show you’re thinking about impact beyond your own desk and understand how cross-company collaboration fuels real progress.